Vacuum Release Demo
VR Trays are ideal for: Extremely fragile or thin devices Handling bare die No contact with edges or top surface of device Handling device sizes (X,Y) ranging from 250 micron to 75mm High-volume automated device Pick & Place applications Manual unloading using Vacuum Pens For devices smaller than 250 micron the NDT Tray should be used. For devices larger than 75mm, the Wafer/Large Format VR Plates should be used.
VR Trays are ideal for: Extremely fragile or thin devices Handling bare die No contact with edges or top surface of device Handling device sizes (X,Y) ranging from 250 micron to 75mm High-volume automated device Pick & Place applications Manual unloading using Vacuum Pens For devices smaller than 250 micron the NDT Tray should be used. For devices larger than 75mm, the Wafer/Large Format VR Plates should be used.